Shenzhen Tongxinke Electronic Technology Co., Ltd.
ຮຸ່ນ No: DLC70D(0805)
The file is encrypted. Please fill in the following information to continue accessing it
| Capacitance (pF) | Code | Tolerance | Rated Voltage | Capacitance (pF) | Code | Tolerance | Rated Voltage | Capacitance (pF) | Code | Tolerance | Rated Voltage |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 0.1 | 0R1 | 2.4 | 2R4 | 20 | 200 | ||||||
| 0.2 | 0R2 | 2.7 | 2R7 | 22 | 220 | ||||||
| 0.3 | 0R3 | 3.0 | 3R0 | 24 | 240 | ||||||
| 0.4 | 0R4 | 3.3 | 3R3 | A, B, C, D. | 27 | 270 | |||||
| 0.5 | 0R5 | 3.6 | 3R6 | 30 | 300 | ||||||
| 0.6 | 0R6 | 3.9 | 3R9 | 33 | 330 | ||||||
| 0.7 | 0R7 | 4.3 | 4R3 | 36 | 360 | ||||||
| 0.8 | 0R8 | 4.7 | 4R7 | 39 | 390 | ||||||
| 0.9 | 0R9 | 5.1 | 5R1 | 43 | 430 | ||||||
| 1.0 | 1R0 | A, B, C, D. | 250V Code: 251 | 5.6 | 5R6 | 47 | 470 | F, G, J. | 250V Code: 251 | ||
| 1.1 | 1R1 | 6.2 | 6R2 | 250V Code: 251 | 51 | 510 | |||||
| 1.2 | 1R2 | 6.8 | 6R8 | B, C, D. | 56 | 560 | |||||
| 1.3 | 1R3 | 7.5 | 7R5 | 62 | 620 | ||||||
| 1.4 | 1R4 | 8.2 | 8R2 | 68 | 680 | ||||||
| 1.5 | 1R5 | 9.1 | 9R1 | 75 | 750 | ||||||
| 1.6 | 1R6 | 10 | 100 | F, G, J. | 82 | 820 | |||||
| 1.7 | 1R7 | 11 | 110 | 91 | 910 | ||||||
| 1.8 | 1R8 | 12 | 120 | 100 | 101 | ||||||
| 1.9 | 1R9 | 13 | 130 | 120 | 121 | ||||||
| 2.0 | 2R0 | 15 | 150 | 150 | 151 | ||||||
| 2.1 | 2R1 | 16 | 160 | ||||||||
| 2.2 | 2R2 | 18 |
| Termination Code | Type / Outline | Capacitor Dimensions | Terminal Electrode (B) | Terminal Electrode Material | ||
|---|---|---|---|---|---|---|
| Length (Lc) | Width (Wc) | Thickness (Tc) | ||||
| W | Chip type | .079 ± .008
|
.049 ± .008
|
.057 (1.45) max | .014 ~ .028
|
Nickel-plated, tin-plated, RoHS compliant |
| L | Chip type | (same as above) | Nickel-plated, 10Pb90Sn plated | |||
| P (Non-magnetic) | Chip type | .079 ± .008
|
.049 ± .008
|
.057 (1.45) max | .014 ~ .028
|
Copper-plated, tin-plated, RoHS compliant |
| Kit Part No. | Capacitance Range (pF) | Capacitance Values (pF) | Tolerance |
|---|---|---|---|
| DKDLC70D01 | 0.1 ~ 2.0 | 0.1, 0.2, 0.3, 0.5, 0.7, 0.8, 0.9, 1.0, 1.3, 1.5, 1.7, 1.9, 2.0 | ±0.1 pF |
| DKDLC70D02 | 1.0 ~ 10 | 1.0, 1.3, 1.5, 1.7, 1.9, 2.0, 2.2, 2.7, 3.0, 3.9, 4.7, 5.6, 6.8, 7.5, 8.2 | ±0.1 pF |
| 10 | ±5% | ||
| DKDLC70D03 | 10 ~ 68 | 10, 13, 15, 18, 20, 22, 27, 30, 39, 47, 56, 68 | ±5% |
| Item | Specification |
|---|---|
| Quality Factor (Q value) | ≥ 2000, at 1 ± 0.1 MHz, 1 ± 0.2 Vrms. |
| Insulation Resistance (IR) | ≥ 10⁵ MΩ at 25°C, rated voltage applied.
|
| Dielectric Withstanding Voltage (DWV) | 250% of rated voltage applied for 5 seconds. |
| Operating Temperature Range | -55°C ~ +125°C
|
| Temperature Coefficient (TC) | 0 ± 30 ppm/°C |
| Capacitance Drift | ±0.2% or ±0.05 pF, whichever is greater. |
| Piezoelectric Effect | None |
| Item | Specification | Method |
|---|---|---|
| Resistance to Soldering Heat | Appearance: No mechanical damage.
|
Preheat at 150°C ~ 180°C for 1 minute, immerse in solder at 260 ± 5°C for 10 ± 1 seconds, and test after cooling for 24 ± 2 hours. |
| Thermal Shock | Appearance: No mechanical damage.
|
Test in accordance with MIL-STD-202, Method 107, Condition A.
|
| Moisture Resistance | Appearance: No mechanical damage.
|
Test in accordance with MIL-STD-202, Method 106. |
| Steady State Humidity Heat | Appearance: No mechanical damage.
|
Test in accordance with MIL-STD-202, Method 103, Condition A.
|
| Life (Endurance) | Appearance: No mechanical damage.
|
Test in accordance with MIL-STD-202, Method 108.
|
ຖະແຫຼງການຄວາມເປັນສ່ວນຕົວ: ຄວາມເປັນສ່ວນຕົວຂອງທ່ານມີຄວາມສໍາຄັນຫຼາຍຕໍ່ພວກເຮົາ. ບໍລິສັດຂອງພວກເຮົາສັນຍາວ່າຈະເປີດເຜີຍຂໍ້ມູນສ່ວນຕົວຂອງທ່ານໃຫ້ກັບການອະນຸຍາດທີ່ຊັດເຈນຂອງທ່ານ.
ຕື່ມຂໍ້ມູນໃສ່ໃນຂໍ້ມູນເພີ່ມເຕີມເພື່ອໃຫ້ໄດ້ຮັບການສໍາພັດກັບທ່ານໄວຂື້ນ
ຖະແຫຼງການຄວາມເປັນສ່ວນຕົວ: ຄວາມເປັນສ່ວນຕົວຂອງທ່ານມີຄວາມສໍາຄັນຫຼາຍຕໍ່ພວກເຮົາ. ບໍລິສັດຂອງພວກເຮົາສັນຍາວ່າຈະເປີດເຜີຍຂໍ້ມູນສ່ວນຕົວຂອງທ່ານໃຫ້ກັບການອະນຸຍາດທີ່ຊັດເຈນຂອງທ່ານ.
ຕິດຕໍ່ຕອນນີ້