Shenzhen Tongxinke Electronic Technology Co., Ltd.
ຮຸ່ນ No: SA Series
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| Code | Terminal Type | Sputtered Metal Layer | Electroplated Layer | ||
|---|---|---|---|---|---|
| Material | Thickness (µm) | Material | Thickness (µm) | ||
| M | Suitable for Au/Sn and conductive epoxy bonding; not compatible with Sn/Pb soldering. | TiW/Au | 0.01 ~ 0.05 / 0.03 ~ 0.05 | Au | ≥ 2 |
| P | Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding. | TiW/Ni/Au | 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05 | Au | ≥ 2 |
| T | Suitable for Au/Sn and conductive epoxy bonding; not compatible with Sn/Pb soldering. | TaN/TiW/Au | 0.03 ~ 0.10 / 0.1 ~ 0.2 / 0.03 ~ 0.05 | Au | ≥ 2 |
| F | Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding. | TaN/TiW/Ni/Au | 0.03 ~ 0.10 / 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05 | Au | ≥ 2 |
| H | Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding. | TaN/TiW/Pt/Au | 0.03 ~ 0.10 / 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05 | Au | ≥ 2 |
| D | Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding. | TiW/Pt/Au | 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05 | Au | ≥ 2 |
| E | Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding. | Ti/Pt/Au | 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05 | Au | ≥ 2 |
| X | Suitable for conductive epoxy bonding. | TiW/Ni/Ag | 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.10 ~ 0.20 | - | - |
| L | Backside suitable for conductive epoxy bonding. | Front: Ti/Pt/Au
|
0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05 | Au | ≥ 2 |
| Code | Rated Voltage (V) | Code | Rated Voltage (V) |
| A | 10 | 6 | 63 |
| B | 16 | 1 | 100 |
| 2 | 25 | C | 120 |
| 5 | 50 |
ຖະແຫຼງການຄວາມເປັນສ່ວນຕົວ: ຄວາມເປັນສ່ວນຕົວຂອງທ່ານມີຄວາມສໍາຄັນຫຼາຍຕໍ່ພວກເຮົາ. ບໍລິສັດຂອງພວກເຮົາສັນຍາວ່າຈະເປີດເຜີຍຂໍ້ມູນສ່ວນຕົວຂອງທ່ານໃຫ້ກັບການອະນຸຍາດທີ່ຊັດເຈນຂອງທ່ານ.
ຕື່ມຂໍ້ມູນໃສ່ໃນຂໍ້ມູນເພີ່ມເຕີມເພື່ອໃຫ້ໄດ້ຮັບການສໍາພັດກັບທ່ານໄວຂື້ນ
ຖະແຫຼງການຄວາມເປັນສ່ວນຕົວ: ຄວາມເປັນສ່ວນຕົວຂອງທ່ານມີຄວາມສໍາຄັນຫຼາຍຕໍ່ພວກເຮົາ. ບໍລິສັດຂອງພວກເຮົາສັນຍາວ່າຈະເປີດເຜີຍຂໍ້ມູນສ່ວນຕົວຂອງທ່ານໃຫ້ກັບການອະນຸຍາດທີ່ຊັດເຈນຂອງທ່ານ.
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