Shenzhen Tongxinke Electronic Technology Co., Ltd.
ຮຸ່ນ No: Single Layer Capacitor
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| General Type SG | Margin Type SM | Surface Mount Type SS | Array Type SA | Multi-Electrode Type SP |
|---|---|---|---|---|
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| Suitable for RF, microwave, and millimeter-wave applications. Capacitance range: 0.1 ~ 10000 pF | Suitable for RF, microwave, and millimeter-wave applications. Capacitance range: 0.1 ~ 10000 pF | High-precision single-layer series capacitors | An array composed of multiple single-layer capacitors, suitable for multi-channel coupling and bypass applications. | Multi-value, binary-tunable single-layer capacitors, suitable for tuning designs or microwave integrated circuits. |
| Inspection Group | Parameter | Test Method | Test Requirements |
|---|---|---|---|
| A1 | Capacitance | GJB2442A-2021 Method 4.5.4 | 100% inspection |
| A1 | Dissipation Factor (tanδ) | GJB2442A-2021 Method 4.5.5 | 100% inspection |
| A1 | Insulation Resistance | GJB2442A-2021 Method 4.5.6 | 100% inspection |
| A1 | Dielectric Withstanding Voltage | GJB2442A-2021 Method 4.5.7 | 100% inspection |
| A3 | Visual Inspection | GJB2442A-2021 Method 4.5.2 | 100% inspection |
| B2 | Bond Strength | GJB548C-2021 Method 2011.2 | Gold wire diameter 25µm, minimum pull force 5gf |
| B2 | Shear Strength | GJB548C-2021 Method 2019.3 | GJB548C-2021 Method 2019.3 |
| B3 | Voltage-Temperature Characteristic | GJB2442A-2021 Method 4.5.11 | GJB2442A-2021 Requirement 3.14 |
| C1 | Immersion | GJB2442A-2021 Method 4.5.12 | GJB2442A-2021 Requirement 3.15 |
| C2 | Resistance to Soldering Heat | GJB360B-2009 Method 210 | GJB2442A-2021 Requirement 3.16 |
| C3 | Steady-State Humidity (Low Voltage) | GJB2442A-2021 Method 4.5.14 | GJB2442A-2021 Requirement 3.17 |
| C4 | Life | GJB2442A-2021 Method 4.5.15 | GJB2442A-2021 Requirement 3.18 |
| General Type SG | Margin Type SM | Surface Mount Type SS |
|---|---|---|
|
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|
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| Suitable for RF, microwave, and millimeter-wave applications.
|
Suitable for RF, microwave, and millimeter-wave applications.
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High-precision single-layer series capacitors.
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| Code | Terminal Type | Sputtered Metal Layer | Electroplated Layer | ||
|---|---|---|---|---|---|
| Material | Thickness (µm) | Material | Thickness (µm) | ||
| M | Suitable for Au/Sn and conductive epoxy bonding; not compatible with Sn/Pb soldering. | TiW/Au | 0.01 ~ 0.05 / 0.03 ~ 0.05 | Au | ≥ 2 |
| P | Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding. | TiW/Ni/Au | 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05 | Au | ≥ 2 |
| T | Suitable for Au/Sn and conductive epoxy bonding; not compatible with Sn/Pb soldering. | TaN/TiW/Au | 0.03 ~ 0.10 / 0.1 ~ 0.2 / 0.03 ~ 0.05 | Au | ≥ 2 |
| F | Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding. | TaN/TiW/Ni/Au | 0.03 ~ 0.10 / 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05 | Au | ≥ 2 |
| H | Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding. | TaN/TiW/Pt/Au | 0.03 ~ 0.10 / 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05 | Au | ≥ 2 |
| D | Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding. | TiW/Pt/Au | 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05 | Au | ≥ 2 |
| E | Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding. | Ti/Pt/Au | 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05 | Au | ≥ 2 |
| X | Suitable for conductive epoxy bonding. | TiW/Ni/Ag | 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.10 ~ 0.20 | - | - |
| L | Backside suitable for conductive epoxy bonding. | Front: Ti/Pt/Au
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0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05 | Au | ≥ 2 |
| Code | Rated Voltage (V) | Code | Rated Voltage (V) |
| A | 10 | 6 | 63 |
| B | 16 | 1 | 100 |
| 2 | 25 | C | 120 |
| 5 | 50 |
ຖະແຫຼງການຄວາມເປັນສ່ວນຕົວ: ຄວາມເປັນສ່ວນຕົວຂອງທ່ານມີຄວາມສໍາຄັນຫຼາຍຕໍ່ພວກເຮົາ. ບໍລິສັດຂອງພວກເຮົາສັນຍາວ່າຈະເປີດເຜີຍຂໍ້ມູນສ່ວນຕົວຂອງທ່ານໃຫ້ກັບການອະນຸຍາດທີ່ຊັດເຈນຂອງທ່ານ.
ຕື່ມຂໍ້ມູນໃສ່ໃນຂໍ້ມູນເພີ່ມເຕີມເພື່ອໃຫ້ໄດ້ຮັບການສໍາພັດກັບທ່ານໄວຂື້ນ
ຖະແຫຼງການຄວາມເປັນສ່ວນຕົວ: ຄວາມເປັນສ່ວນຕົວຂອງທ່ານມີຄວາມສໍາຄັນຫຼາຍຕໍ່ພວກເຮົາ. ບໍລິສັດຂອງພວກເຮົາສັນຍາວ່າຈະເປີດເຜີຍຂໍ້ມູນສ່ວນຕົວຂອງທ່ານໃຫ້ກັບການອະນຸຍາດທີ່ຊັດເຈນຂອງທ່ານ.
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